تمكننا معدات التجميع الحديثة لدينا من تلبية احتياجات تجميع الدوائر الالكترونية تحت سقف واحد، تتضمن قدراتنا على تجميع لوحات الدوائر المطبوعة

SMT Assembly

Through-Hole Assembly

Mixed Assembly

Electro-Mechanical Assembly

Box Build Assembly

Product Assembly

SMT Packages

Rigid Flex PCB Assembly Services

القدرات

Assembly Types Single- & double-sided placement (SMT/Thru-hole)
PCB Layer 1 – 32 layers
Thickness 0.4mm – 2.0mm
Dimension Single PCB Size: 70x70mm – 510x460mm, PCB Panel Size: 70x70mm -250x250mm
Order Volume 2 – 80000 pcs
Surface Finish No limit
PCB Color No limit
Delivery Format Single PCB, Panel with mouse bites, Panel with V-cut
Layer Stackup All stack-up
Edge Rails Necessary
Fiducials Necessary
Minimum Package 201
Minimum Package 201
Minimum IC Pin Spacing 0.35mm
Minimum BGA Spacing 0.5mm
Reflow temperature 240+/-5 °C
SPI Yes
AOI Yes
Visual Inspection Yes
X-ray Inspection Yes
Cleaning Water soluble is our standard flux. All assembled boards are cleaned with de-ionized water
Build time ≥ 4 days