PCB - الرواد للأنظمة التقنية المحدودة

لدينا خطوط إنتاج لتصنيع لوحات الدوائر المطبوعة أحادية الطبقة، وطبقتين، ومتعددة الطبقات تصل إلى 32 طبقة بطاقة إنتاجية شهرية تصل إلى 10,000 متر مربع.

نقوم بتصنيع دوائر إلكترونية صلبة ومرنة وفائقة الكثافة باستخدام أحدث تقنيات التصنيع وباتباع أعلى معايير الجودة والسلامة.

المنتجات

HDI صلب

النوع:
جامد -HDI
المواد المستخدمة:
High-performance FR4, Rigid polyimide, low loss hydrocarbon, low loss PTEF
عدد الطبقات:
1-52 طبقة
درجة السمك:
0.6 – 3.2 ملم
ملاحظات خاصة:
3 SBU (بناء متسلسل)

مرن

النوع:
مرن
المواد المستخدمة:
Flex polyimide
عدد الطبقات:
1-4 L
سمك ثنائي الفينيل متعدد الكلور:
0.03 – 0.1 ملم
ملاحظات خاصة:
Small coverlay opening

صلب-مرن

النوع:
صلب-مرن
المواد المستخدمة:
High-performance FR4, Rigid polyimide, Flex Polyimide
عدد الطبقات:
4-16 L
درجة السمك:
1.6 ملم
ملاحظات خاصة:
ايكو بوند

القدرات

FEATURE	Standard	Advanced	Cutting Edge
Minimµm Inner Line Width	100	75	50
Minimµm Outer Space	100	100	75
Minimµm Outer Space	100	75	50
Minimµm Inner Space	100	75	50
Minimµm Outer Space (Pad/Plane)	100	75	50
Internal Etch tolerance (+/-)	20%	20%	20%
External Etch tolerance (+/-) For Pattern	20%	20%	20%
Minimµm Space, Conductor to FWB Edge	200 µm	200 µm	200 µm
Layer to Layer Registration (multilayer Rigid Flex)	100	100	100
Layer to Layer Registration (2 layer core)	50	50	50
Minimµm Flex Core Thickness (mm)	0.1	0.05	0.025
Maximµm FWB Thickness (mm)	0.15	0.175	0.2
Overall Thickness Tolerance	10%	10%	8%
Maximµm Layer count	12	16	16
Minimµm Internal Cut-out Radius	2.4 mm	1.2 mm	0.8 mm
Loose Leaf (Rigid Flex)	No	Yes	Yes
Edge Plating (Rigid Flex)	No	Yes	Yes
Individual Stiffener Lamination	No	No	Yes
Panel Stiffener Lamination	No	No	No
Minimµm Stiffener Thickness for Epoxy Stress Relief Fillet (Eccobond Application) (mils)	4	4	4
STIFFENER	Standard	Advanced	Cutting Edge
FR4	Yes	Yes	Yes
Polyimide	Yes	Yes	Yes
Stainless Steel	No	No	No
STIFFENER	Standard	Advanced	Cutting Edge
Adhesive thickness requirements (mils) to adequately bond core to copper layer	Preferred Thickness	Minimµm Thickness
Adhesive Thickness – 0.5 oz Cu	1	1
Adhesive Thickness – 1.0 oz Cu	2	2
Adhesive thickness requirements (mils) to adequately bond coverlay to copper layer	Preferred Thickness	Minimµm Thickness
Adhesive Thickness – 0.5 oz Cu	1	1
Adhesive Thickness – 1.0 oz Cu	2	2
Adhesive thickness (mils) requirements to adequately stiffener to flex	NO	NO
PAD AND HOLE	Standard	Advanced	Cutting Edge
Minimµm Finished Component Plated Hole Size	150 µm	100 µm	75 µm
Component Finished PTH Size Tolerance	+/- 100 µm	+/- 100 µm	+/- 100 µm
Minimµm Finished Hole Size for Plated Stiffener	150 µm	150 µm	150 µm
Via Finished PTH Size Tolerance	+/- 100 µm	+/- 100 µm	+/- 100 µm
PTH Locational Tolerance	+/- 50 µm	+/- 50 µm	+/- 50 µm
Internal Land Size (Diameter over Drill)	100 µm	75 µm	75 µm
Internal Anti-pad (Diameter over Drill)	100 µm	75 µm	75 µm
External Land Size (Diameter over Finished Hole)	100 µm	75 µm	75 µm
Min. Internal Plated Hole to Trace Spacing	200 µm	200 µm	200 µm
Smallest Mechanical Drill Size	200 µm	150 µm	100 µm
Maximµm Aspect Ratio (w/ min. drill)	10 to 1	12 to 1	15 to 1
Maximµm Drill Hole Size	5.8	5.8	5.8
NPTH Size Tolerance	+/- 50 µm	+/- 50 µm	+/- 50 µm
NPTH Locational Tolerance	+/- 50 µm	+/- 50 µm	+/- 50 µm
Min. Outer Non-Plated Hole to Trace Spacing	200 µm	200 µm	200 µm
Min. Inner Non-Plated Hole to Trace Spacing	200 µm	200 µm	200 µm
Blind/Buried Vias (All Types)	No	No	No
Via Fill (Non-Conductive)	Yes	Yes	Yes
COVERLAY	Standard	Advanced	Cutting Edge
Coverlay Registration Tolerance	+/-75µm	+/- 50 µm	+/- 50 µm
Minimµm Feature Size (Cutout)	0.75 mm	0.5 mm	150 µm
Feature Tolerance	20 %’+/-	20 %’+/-	20 %’+/-
Minimµm Features Spacing	200 µm	150 µm	100 µm
Feature Spacing Tolerance	20’+/-	20’+/-	20’+/-
Mechanical Routed Features	Yes	Yes	Yes
Laser Routed Features	Yes	Yes	Yes
Gang Opening Minimµm Internal Radius	100 µm	100 µm	100 µm
SOLDER MASK	Standard	Advanced	Cutting Edge
Flex LPI Use on Flexible Sections	No	Yes	Yes
Inkjet Solder Mask	No	No	No
Minimµm LPI Solder Mask Dam	No	Yes	Yes
Solder Mask Registration (+/-)	+/- 40 µm	+/- 40 µm	+/- 40 µm
Solder Mask Via Plug w/LPI	No	Yes	Yes
Solder Mask using Laser Direct Imaging	Yes	Yes	Yes
Available Colors
Legend Print	Standard	Advanced	Cutting Edge
Screen Print	Yes	Yes	Yes
Available Colors
Ink Jet	No	No	No
Available Colors
Copper Etch	No	No	No
MATERIALS	Standard	Advanced	Cutting Edge
Standard Panel Size	610×457 or 560×457	610×457 or 560×458	610×457 or 560×459
Maximµm Panel Size	610×457 or 560×457	610×457 or 560×458	610×457 or 560×459
Maximµm Board Size	610×457 or 560×457	610×457 or 560×458	610×457 or 560×459
Fabricated Dimension Tolerances (+/-µm )	+/- 200 µm	+/- 100 µm	+/- 100 µm
Minimµm Dielectric Thickness	0.1 mm	50 µm	50 µm
Minimµm Copper Weight – Inner Layers (oz)	0.5 (18 µm)	0.25 (9 µm)	0.125 (5 µm)
Minimµm Copper Weight – Outer Layers (oz)	1.5 (45 µm)	1 (35 µm)	1 (35 µm)
Maximµm Copper Weight – Inner Layers (oz)	0.5,1 (18 µm&35 µm)	2 (70 µm)	2 (70 µm)
Maximµm Copper Weight – Outer Layers (oz)	1.5 (45 µm)	2 (70 µm)	3 (105 µm)
SURFACE FINISHES	Standard	Advanced	Cutting Edge
Selective Solder Strip	No	No	No
Electroless Nickel, Immersion Gold (ENIG)	Yes	Yes	Yes
HDI	Standard	Advanced	Cutting Edge
HDI Type (I, II, III)	I	II	III
Minimµm Laser Via Drill Diameter	75 µm	75 µm	50 µm
Laser Via Land Size (Diameter over Drill)	75 µm	50 µm	50 µm
Laser Via Aspect Ratio	1 to 1 max	1 to 1 max	1 to 1 max
IMPEDANCE	Standard	Advanced	Cutting Edge
Single-ended (+/- %)	+/- 10 %	+/- 10 %	+/- 10 %
Differential, Edge-coupled (+/- %)	+/- 10 %	+/- 10 %	+/- 10 %
Differential, Broadside-Coupled (+/- %)	+/- 10 %	+/- 10 %	+/- 10 %
In-house Testing/Verification	Yes	Yes	Yes
TECHNOLOGY	Standard	Advanced	Cutting Edge
Etchback	No	Yes	Yes
B-Stage Backed Rigid Section (Rigid Flex)	Yes	Yes	Yes
B-Stage Backed Rigid Section with test points (Rigid Flex)	No	No	No
Heat Sinks	No	No	No
Edge Plating	No	Yes	Yes